APEL Postforming Glue
BK 180
APEL Postforming Glue
Description
APEL Postforming Glue is a water based PVAc. glue that is used to bond laminate papers to MDF or chipboards. It is also used for postforming applications and very suitable for high temperature applications. It is highly resistant to different sources of temperature and will not debond even in risky applications. It does corrose, get moldy or char and highly resistant to physical effects.
Features
- The glue will not debond under high temperatures in application.
- No colorization, charring or fading in application.
- Strong physical resistance against impacts aftercured.
- Semi-transparent color.
- İt is resistant to press processing at very high temperatures.
- It contains special protectants against bacterial spoilage and mold.
Application Area
Glue is used to bond HPL and CPL laminaton papers under high heat to MDF, chipboard and solid wood for kitchen counter productions Suitable for roller press applications. Suitable for cold press lamination. (Check press time)
Packages
Warnings
Similar products
390g
